INTERNATIONAL PATENT: PN JUNCTION SEMICONDUCTOR (ZHEJIANG) CO., LTD., 派恩杰半导体（浙江）有限公司 FILES APPLICATION FOR "PLASTIC-ENCAPSULATED BOOST SEMICONDUCTOR MODULE AND PACKAGING STRUCTURE"

GENEVA, Dec. 15 -- PN JUNCTION SEMICONDUCTOR (ZHEJIANG) CO., LTD. (Room A160, Building 1, No. 316, Binhai 4th Road, Qianwan New AreaNingbo, Zhejiang 315336), 派恩杰半导体（浙江）有限公司 (中国浙江省宁波市前湾新区滨海四路316号1号楼A160) filed a patent application (PCT/CN2025/099258) for "PLASTIC-ENCAPSULATED BOOST SEMICONDUCTOR MODULE AND PACKAGING STRUCTURE" on Jun 05, 2025. With publication no. WO/2025/252145, the details related to the patent application was published on Dec 11, 2025.

Notably, the patent application was submitted under the Int...