INTERNATIONAL PATENT: OSAKA UNIVERSITY, 国立大学法人大阪大学, TANAKA PRECIOUS METAL TECHNOLOGIES CO., LTD., 田中貴金属工業株式会社 FILES APPLICATION FOR "BONDING MATERIAL AND BONDING METHOD EMPLOYING SAID BONDING MATERIAL"

Posted On: 2025-10-05

GENEVA, Oct. 5 -- OSAKA UNIVERSITY (1-1, Yamadaoka, Suita-shi, Osaka5650871), 国立大学法人大阪大学 (大阪府吹田市山田丘１番１号), TANAKA PRECIOUS METAL TECHNOLOGIES CO., LTD. (2-6-6 Nihonbashi Kayabacho, Chuo-ku, Tokyo1030025), 田中貴金属工業株式会社 (東京都中央区日本橋茅場町二丁目６番６号) filed a patent application (PCT/JP2025/011375) for "BONDING MATERIAL AND BONDING METHOD EMPLOYING SAID BONDING MATERIAL" on Mar 24, 2025. Wit...

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INTERNATIONAL PATENT: OSAKA UNIVERSITY, 国立大学法人大阪大学, TANAKA PRECIOUS METAL TECHNOLOGIES CO., LTD., 田中貴金属工業株式会社 FILES APPLICATION FOR "BONDING MATERIAL AND BONDING METHOD EMPLOYING SAID BONDING MATERIAL"