GENEVA, Dec. 9 -- OSAKA SODA CO., LTD. (JP Tower Osaka 19F, 2-2, Umeda 3-chome, Kita-ku, Osaka-shi, Osaka5300001), 株式会社大阪ソーダ (大阪府大阪市北区梅田三丁目２番２号 ＪＰタワー大阪１９階) filed a patent application (PCT/JP2025/018448) for "ELECTROCONDUCTIVE ADHESIVE" on May 21, 2025. With publication no. WO/2025/249276, the details related to the patent application was published on Dec 04, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed ...