GENEVA, March 31 -- OSAKA REIKEN CO., LTD. (7-18, Yoshitahonmachi 1-chome, Higashiosaka-shi, Osaka5780982), 株式会社大阪冷研 (大阪府東大阪市吉田本町１丁目７番１８号) filed a patent application (PCT/JP2024/020959) for "DRYING DEVICE FOR SYNTHETIC RESIN MOLDING MATERIAL" on Jun 10, 2024. With publication no. WO/2025/062762, the details related to the patent application was published on Mar 27, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Invent...