GENEVA, March 10 -- OKUNO CHEMICAL INDUSTRIES CO., LTD. (4-7-10, Doshomachi, Chuo-ku, Osaka-shi, Osaka5410045), 奥野製薬工業株式会社 (大阪府大阪市中央区道修町4丁目7番10号) filed a patent application (PCT/JP2024/029819) for "PARTICLE DISPERSION, PRODUCTION METHOD THEREFOR, PARTICLE-CONTAINING PLATING SOLUTION, PARTICLE-CONTAINING PLATING FILM, AND PARTICLE-CONTAINING PLATING METHOD" on Aug 22, 2024. With publication no. WO/2025/047567, the details related to the patent application was published on Mar 06, 2025.
Notably, the patent application was submitted und...