GENEVA, April 19 -- OKUNO CHEMICAL INDUSTRIES CO., LTD. (4-7-10, Doshomachi, Chuo-ku, Osaka-shi, Osaka5410045), 奥野製薬工業株式会社 (大阪府大阪市中央区道修町４丁目７番１０号), OSAKA UNIVERSITY (1-1, Yamadaoka, Suita-shi, Osaka5650871), 国立大学法人大阪大学 (大阪府吹田市山田丘１番１号) filed a patent application (PCT/JP2024/024010) for "PLATING FILM FOR METAL SINTERING BONDING, METHOD FOR MANUFACTURING SAME, AND SEMICONDUCTOR MO...