INTERNATIONAL PATENT: NORITAKE CO., LIMITED, ノリタケ株式会社 FILES APPLICATION FOR "WAFER POLISHING DEVICE, POLISHING PAD AND WAFER POLISHING METHOD"

GENEVA, Oct. 5 -- NORITAKE CO., LIMITED (3-1-36, Noritake-shinmachi, Nishi-ku, Nagoya-shi, Aichi4518501), ノリタケ株式会社 (愛知県名古屋市西区則武新町三丁目１番３６号) filed a patent application (PCT/JP2025/008746) for "WAFER POLISHING DEVICE, POLISHING PAD, AND WAFER POLISHING METHOD" on Mar 10, 2025. With publication no. WO/2025/204798, the details related to the patent application was published on Oct 02, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property...