GENEVA, Oct. 5 -- NORITAKE CO., LIMITED (3-1-36, Noritake-shinmachi, Nishi-ku, Nagoya-shi, Aichi4518501), ノリタケ株式会社 (愛知県名古屋市西区則武新町三丁目１番３６号) filed a patent application (PCT/JP2025/004465) for "POLISHING PAD AND WAFER POLISHING METHOD" on Feb 12, 2025. With publication no. WO/2025/204212, the details related to the patent application was published on Oct 02, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
In...