GENEVA, Oct. 5 -- NORITAKE CO., LIMITED (3-1-36, Noritakeshinmachi, Nishi-ku, Nagoya-shi, Aichi4518501), ノリタケ株式会社 (愛知県名古屋市西区則武新町三丁目１番３６号) filed a patent application (PCT/JP2025/003981) for "BONDING MATERIAL FOR HEAT-DISSIPATING SUBSTRATE, METHOD FOR MANUFACTURING HEAT-DISSIPATING SUBSTRATE, AND HEAT-DISSIPATING SUBSTRATE" on Feb 06, 2025. With publication no. WO/2025/204172, the details related to the patent application was published on Oct 02, 2025.
Notably, the patent application was submitted under the International Patent Classification...