GENEVA, Oct. 5 -- NITTO DENKO CORPORATION (1-1-2, Shimohozumi, Ibaraki-shi, Osaka5678680), 日東電工株式会社 (大阪府茨木市下穂積1丁目1番2号) filed a patent application (PCT/JP2025/009608) for "LAMINATE, IMPRINT SUBSTRATE, REPLICA MOLD, METHOD FOR MANUFACTURING SAME, AND IMPRINT DEVICE" on Mar 13, 2025. With publication no. WO/2025/204988, the details related to the patent application was published on Oct 02, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inven...