INTERNATIONAL PATENT: NISSHIN SEIFUN WELNA INC., 株式会社日清製粉ウェルナ FILES APPLICATION FOR "PUFFED AND GROUND PRODUCT OF RICE FLOUR DOUGH AND BATTER MATERIAL FOR FRIED FOOD"

GENEVA, Oct. 14 -- NISSHIN SEIFUN WELNA INC. (25, Kanda-Nishiki-cho 1-chome, Chiyoda-ku, Tokyo1018441), 株式会社日清製粉ウェルナ (東京都千代田区神田錦町一丁目２５番地) filed a patent application (PCT/JP2025/013315) for "PUFFED AND GROUND PRODUCT OF RICE FLOUR DOUGH AND BATTER MATERIAL FOR FRIED FOOD" on Apr 01, 2025. With publication no. WO/2025/211347, the details related to the patent application was published on Oct 09, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World ...