GENEVA, Nov. 3 -- NIPPON PAPER INDUSTRIES CO., LTD. (4-1, Oji 1-chome, Kita-ku, Tokyo1140002), 日本製紙株式会社 (東京都北区王子１丁目４番１号) filed a patent application (PCT/JP2025/013387) for "FIBER MOLDED BODY AND APPLICATION THEREOF" on Apr 01, 2025. With publication no. WO/2025/225305, the details related to the patent application was published on Oct 30, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): IMAI, Daisuke (c/o NIPPON PAPER INDUSTRIES CO., LTD., 2...