GENEVA, July 3 -- NIPPON MICROMETAL CORPORATION (158-1 Oaza Sayamagahara, Iruma-shi, Saitama3580032), 日鉄マイクロメタル株式会社 (埼玉県入間市大字狭山ヶ原１５８番地１) filed a patent application (PCT/JP2024/044531) for "BONDING WIRE" on Dec 17, 2024. With publication no. WO/2025/135010, the details related to the patent application was published on Jun 26, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): ETO, ...