GENEVA, March 8 -- NEVEM INTELLIGENT TECHNOLOGY (SHANGHAI) CO., LTD. (1st Floor, Block A, 1st Building, No.601, Jiamei Road, Nanxiang TownJiading District, Shanghai 201802), 邦迪智能科技（上海）股份有限公司 (中国上海市嘉定区南翔镇嘉美路601号1幢A区1层) filed a patent application (PCT/CN2024/090033) for "3D BENDING MECHANISM FOR HAIRPIN FLAT WIRE" on Apr 26, 2024. With publication no. WO/2025/044253, the details related to the patent application was published on Mar 06, 2025.
Notably, the patent application was submitted under the Internatio...