INTERNATIONAL PATENT: NATIONAL UNIVERSITY CORPORATION HOKKAIDO UNIVERSITY, 国立大学法人北海道大学 FILES APPLICATION FOR "COPPER PARTICLES COATED WITH SLIGHTLY OXIDIZED COPPER, MATERIAL FOR SINTERING CONTAINING SAME, SINTERED BODY USING SAID MATERIAL FOR SINTERING AND JOINED BODY"

GENEVA, July 29 -- NATIONAL UNIVERSITY CORPORATION HOKKAIDO UNIVERSITY (Kita 8-jyo Nishi 5-chome, Kita-ku, Sapporo-shi, Hokkaido0600808), 国立大学法人北海道大学 (北海道札幌市北区北８条西５丁目) filed a patent application (PCT/JP2025/001158) for "COPPER PARTICLES COATED WITH SLIGHTLY OXIDIZED COPPER, MATERIAL FOR SINTERING CONTAINING SAME, SINTERED BODY USING SAID MATERIAL FOR SINTERING, AND JOINED BODY" on Jan 16, 2025. With publication no. WO/2025/154759, the details related to the patent application was published on Jul 24, 2025.

Notably, the patent application was submitted under the...