INTERNATIONAL PATENT: NATIONAL CENTER FOR ADVANCED PACKAGING CO., LTD., 华进半导体封装先导技术研发中心有限公司 FILES APPLICATION FOR "CO-PACKAGED OPTICS STRUCTURE AND MANUFACTURING METHOD THEREFOR"

Posted On: 2025-07-18

GENEVA, July 18 -- NATIONAL CENTER FOR ADVANCED PACKAGING CO., LTD. (Building D1, China Sensor Network International Innovation Park, 200 Linghu Boulevard, Taihu International Tech-Park, Xinwu DistrictWuxi, Jiangsu 214135), 华进半导体封装先导技术研发中心有限公司 (中国江苏省无锡市新吴区太湖国际科技园菱湖大道200号中国传感网国际创新园D1栋) filed a patent application (PCT/CN2024/105750) for "CO-PACKAGED OPTICS STRUCTURE AND MANUFACT...

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INTERNATIONAL PATENT: NATIONAL CENTER FOR ADVANCED PACKAGING CO., LTD., 华进半导体封装先导技术研发中心有限公司 FILES APPLICATION FOR "CO-PACKAGED OPTICS STRUCTURE AND MANUFACTURING METHOD THEREFOR"