INTERNATIONAL PATENT: NATIONAL CENTER FOR ADVANCED PACKAGING CO., LTD, 华进半导体封装先导技术研发中心有限公司 FILES APPLICATION FOR "SILICON BRIDGE MODULE INTEGRATED WITH PASSIVE DEVICE AND MANUFACTURING METHOD FOR SILICON BRIDGE MODULE"

Posted On: 2025-06-20

GENEVA, June 20 -- NATIONAL CENTER FOR ADVANCED PACKAGING CO., LTD (Huajin Semiconductor Phase 2, No. 2 Jingxian Road, Xinwu DistrictWuxi, Jiangsu 214028), 华进半导体封装先导技术研发中心有限公司 (中国江苏省无锡市新吴区景贤路2号华进半导体2期) filed a patent application (PCT/CN2024/105459) for "SILICON BRIDGE MODULE INTEGRATED WITH PASSIVE DEVICE, AND MANUFACTURING METHOD FOR SILICON BRIDGE MODULE" on Jul 15, 2024. With publication no. WO/2025/123666, the details related to the patent application was publis...

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INTERNATIONAL PATENT: NATIONAL CENTER FOR ADVANCED PACKAGING CO., LTD, 华进半导体封装先导技术研发中心有限公司 FILES APPLICATION FOR "SILICON BRIDGE MODULE INTEGRATED WITH PASSIVE DEVICE AND MANUFACTURING METHOD FOR SILICON BRIDGE MODULE"