INTERNATIONAL PATENT: NATIONAL CENTER FOR ADVANCED PACKAGING CO., LTD, 华进半导体封装先导技术研发中心有限公司 FILES APPLICATION FOR "DEEP TRENCH CAPACITOR STRUCTURE AND MANUFACTURING METHOD THEREFOR"

GENEVA, June 29 -- NATIONAL CENTER FOR ADVANCED PACKAGING CO., LTD (Huajin Semiconductor Phase 2, No. 2 Jingxian Road, Xinwu DistrictWuxi, Jiangsu 214028), 华进半导体封装先导技术研发中心有限公司 (中国江苏省无锡市新吴区景贤路2号华进半导体2期) filed a patent application (PCT/CN2024/105460) for "DEEP TRENCH CAPACITOR STRUCTURE AND MANUFACTURING METHOD THEREFOR" on Jul 15, 2024. With publication no. WO/2025/130003, the details related to the patent application was published on Jun 26, 2025.

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