INTERNATIONAL PATENT: NATIONAL CENTER FOR ADVANCED PACKAGING CO., LTD, 华进半导体封装先导技术研发中心有限公司 FILES APPLICATION FOR "BRIDGING PACKAGING STRUCTURE AND FORMING METHOD THEREFOR"

GENEVA, May 4 -- NATIONAL CENTER FOR ADVANCED PACKAGING CO., LTD (Huajin Semiconductor Phase 2, No. 2 Jingxian Road, Xinwu DistrictWuxi, Jiangsu 214028), 华进半导体封装先导技术研发中心有限公司 (中国江苏省无锡市新吴区景贤路2号华进半导体2期) filed a patent application (PCT/CN2024/105462) for "BRIDGING PACKAGING STRUCTURE AND FORMING METHOD THEREFOR" on Jul 15, 2024. With publication no. WO/2025/086730, the details related to the patent application was published on May 01, 2025.

Notably, the patent applicat...