INTERNATIONAL PATENT: NAMICS CORPORATION, ナミックス株式会社 FILES APPLICATION FOR "RESIN COMPOSITION, ADHESIVE AGENT, SEALING MATERIAL, CURED PRODUCT, SEMICONDUCTOR DEVICE AND ELECTRONIC COMPONENT"

GENEVA, June 24 -- NAMICS CORPORATION (3993, Nigorikawa, Kita-ku, Niigata-shi, Niigata9503131), ナミックス株式会社 (新潟県新潟市北区濁川３９９３番地) filed a patent application (PCT/JP2024/041925) for "RESIN COMPOSITION, ADHESIVE AGENT, SEALING MATERIAL, CURED PRODUCT, SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT" on Nov 27, 2024. With publication no. WO/2025/126839, the details related to the patent application was published on Jun 19, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual P...