GENEVA, Sept. 16 -- NAMICS CORPORATION (3993, Nigorikawa, Kita-ku, Niigata-shi, Niigata9503131), ナミックス株式会社 (新潟県新潟市北区濁川３９９３番地) filed a patent application (PCT/JP2025/001602) for "FILM FOR ADHESIVE LAYER, WIRING BOARD, MULTILAYER WIRING BOARD, AND SEMICONDUCTOR DEVICE" on Jan 20, 2025. With publication no. WO/2025/187225, the details related to the patent application was published on Sep 11, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIP...