INTERNATIONAL PATENT: NAKAMURA-TOME PRECISION INDUSTRY CO., LTD., 中村留精密工業株式会社, NATIONAL UNIVERSITY CORPORATION SAITAMA UNIVERSITY, 国立大学法人埼玉大学 FILES APPLICATION FOR "WAFER LASER SLICING METHOD"

Posted On: 2025-04-15

GENEVA, April 15 -- NAKAMURA-TOME PRECISION INDUSTRY CO., LTD. (Ro-15 Netsuno-machi, Hakusan-shi, Ishikawa9202195), 中村留精密工業株式会社 (石川県白山市熱野町ロ１５番地), NATIONAL UNIVERSITY CORPORATION SAITAMA UNIVERSITY (255 Shimo-Okubo, Sakura-ku, Saitama-shi, Saitama3388570), 国立大学法人埼玉大学 (埼玉県さいたま市桜区下大久保２５５) filed a patent application (PCT/JP2023/036410) for "WAFER LASER SLICING METHOD" on Oct 05, 2023. Wi...

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INTERNATIONAL PATENT: NAKAMURA-TOME PRECISION INDUSTRY CO., LTD., 中村留精密工業株式会社, NATIONAL UNIVERSITY CORPORATION SAITAMA UNIVERSITY, 国立大学法人埼玉大学 FILES APPLICATION FOR "WAFER LASER SLICING METHOD"