GENEVA, April 7 -- MITSUI MINING & SMELTING CO., LTD. (1-11-1 Osaki, Shinagawa-Ku, Tokyo1418584), 三井金属鉱業株式会社 (東京都品川区大崎一丁目１１番１号) filed a patent application (PCT/JP2024/033122) for "COPPER FOIL WITH CARRIER, COPPER-CLAD LAMINATE, AND PRINTED WIRING BOARD" on Sep 17, 2024. With publication no. WO/2025/070175, the details related to the patent application was published on Apr 03, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
In...