INTERNATIONAL PATENT: MITSUBISHI MATERIALS ELECTRONIC CHEMICALS CO., LTD., 三菱マテリアル電子化成株式会社 FILES APPLICATION FOR "SILVER-COATED RESIN PARTICLE AND FILLER-CONTAINING PASTE"

GENEVA, Sept. 16 -- MITSUBISHI MATERIALS ELECTRONIC CHEMICALS CO., LTD. (1-6, Barajima 3-chome, Akita-shi, Akita0108585), 三菱マテリアル電子化成株式会社 (秋田県秋田市茨島三丁目１番６号) filed a patent application (PCT/JP2025/006470) for "SILVER-COATED RESIN PARTICLE AND FILLER-CONTAINING PASTE" on Feb 26, 2025. With publication no. WO/2025/187483, the details related to the patent application was published on Sep 11, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intell...