GENEVA, Oct. 5 -- MITSUBISHI MATERIALS CORPORATION (2-3, Marunouchi 3-chome, Chiyoda-ku, Tokyo1008117), 三菱マテリアル株式会社 (東京都千代田区丸の内三丁目２番３号) filed a patent application (PCT/JP2025/012869) for "SOLDER PASTE, SOLDER JOINED BODY, AND METHOD FOR PRODUCING SOLDER JOINED BODY" on Mar 28, 2025. With publication no. WO/2025/206341, the details related to the patent application was published on Oct 02, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Proper...