INTERNATIONAL PATENT: MITSUBISHI MATERIALS CORPORATION, 三菱マテリアル株式会社 FILES APPLICATION FOR "COPPER-CLAD LAMINATE AND SPUTTERING TARGET FOR FORMING COPPER-CLAD LAMINATE"

GENEVA, June 3 -- MITSUBISHI MATERIALS CORPORATION (2-3, Marunouchi 3-chome, Chiyoda-ku, Tokyo1008117), 三菱マテリアル株式会社 (東京都千代田区丸の内三丁目２番３号) filed a patent application (PCT/JP2024/041117) for "COPPER-CLAD LAMINATE AND SPUTTERING TARGET FOR FORMING COPPER-CLAD LAMINATE" on Nov 20, 2024. With publication no. WO/2025/110177, the details related to the patent application was published on May 30, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property...