GENEVA, Feb. 17 -- MITSUBISHI MATERIALS CORPORATION (2-3, Marunouchi 3-chome, Chiyoda-ku, Tokyo1008117), 三菱マテリアル株式会社 (東京都千代田区丸の内三丁目２番３号) filed a patent application (PCT/JP2023/029117) for "BONDED BODY" on Aug 09, 2023. With publication no. WO/2025/032765, the details related to the patent application was published on Feb 13, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): YASOSHIMA Tsukasa (c/o MITS...