GENEVA, Sept. 17 -- MITSUBISHI MATERIALS CORPORATION (2-3, Marunouchi 3-chome, Chiyoda-ku, Tokyo1008117), 三菱マテリアル株式会社 (東京都千代田区丸の内三丁目２番３号) filed a patent application (PCT/JP2025/008537) for "BASE WITH BONDING BUMP, AND METHOD FOR MANUFACTURING BASE WITH BONDING BUMP" on Mar 07, 2025. With publication no. WO/2025/187820, the details related to the patent application was published on Sep 11, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Proper...