INTERNATIONAL PATENT: MITSUBISHI MATERIALS CORPORATION, 三菱マテリアル株式会社, TOHOKU UNIVERSITY, 国立大学法人東北大学 FILES APPLICATION FOR "COPPER ALLOY, COPPER ALLOY PLASTIC PROCESSING MATERIAL, COMPONENT FOR ELECTRONIC AND ELECTRICAL EQUIPMENT, COMPONENT FOR FLEXIBLE DEVICE, HEAT DISSIPATION COMPONENT AND METAL SEALING MATERIAL"

GENEVA, May 27 -- MITSUBISHI MATERIALS CORPORATION (2-3, Marunouchi 3-chome, Chiyoda-ku, Tokyo1008117), 三菱マテリアル株式会社 (東京都千代田区丸の内三丁目２番３号), TOHOKU UNIVERSITY (2-1-1, Katahira, Aoba-ku, Sendai-shi, Miyagi9808577), 国立大学法人東北大学 (宮城県仙台市青葉区片平二丁目１番１号) filed a patent application (PCT/JP2024/039428) for "COPPER ALLOY, COPPER ALLOY PLASTIC PROCESSING MATERIAL, COMPONEN...