GENEVA, Oct. 13 -- MITSUBISHI HEAVY INDUSTRIES, LTD. (2-3, Marunouchi 3-chome, Chiyoda-ku, Tokyo1008332), 三菱重工業株式会社 (東京都千代田区丸の内三丁目２番３号) filed a patent application (PCT/JP2025/002737) for "FILM THICKNESS MEASUREMENT METHOD FOR ADHESIVE AND PRODUCTION METHOD FOR JOINING MEMBER" on Jan 29, 2025. With publication no. WO/2025/210994, the details related to the patent application was published on Oct 09, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property O...