GENEVA, Sept. 30 -- MITSUBISHI CHEMICAL CORPORATION (1-1 Marunouchi 1-chome, Chiyoda-ku, Tokyo1008251), 三菱ケミカル株式会社 (東京都千代田区丸の内一丁目１番１号) filed a patent application (PCT/JP2025/010751) for "THERMOSETTING COMPOSITION, METHOD FOR PRODUCING THERMOSETTING SHEET, THERMALLY CONDUCTIVE SHEET, HEAT-DISSIPATING LAYERED PRODUCT, HEAT-DISSIPATING CIRCUIT BOARD, AND POWER SEMICONDUCTOR DEVICE" on Mar 19, 2025. With publication no. WO/2025/197972, the details related to the patent application was published on Sep 25, 2025.
Notably, the patent application was submitted u...