INTERNATIONAL PATENT: MITSUBISHI CHEMICAL CORPORATION, 三菱ケミカル株式会社 FILES APPLICATION FOR "RESIN COMPOSITION, MOLDING MATERIAL, MULTILAYER STRUCTURE, MOLDED BODY, FOOD PACKAGE AND METHODS FOR PRODUCING RESIN COMPOSITION AND MULTILAYER STRUCTURE"

GENEVA, April 1 -- MITSUBISHI CHEMICAL CORPORATION (1-1, Marunouchi 1-chome, Chiyoda-ku, Tokyo1008251), 三菱ケミカル株式会社 (東京都千代田区丸の内一丁目１番１号) filed a patent application (PCT/JP2024/033302) for "RESIN COMPOSITION, MOLDING MATERIAL, MULTILAYER STRUCTURE, MOLDED BODY, FOOD PACKAGE, AND METHODS FOR PRODUCING RESIN COMPOSITION AND MULTILAYER STRUCTURE" on Sep 18, 2024. With publication no. WO/2025/063202, the details related to the patent application was published on Mar 27, 2025.

Notably, the patent application was submitted under the International Patent Classific...