GENEVA, Oct. 5 -- MITSUBISHI CHEMICAL CORPORATION (1-1, Marunouchi 1-chome, Chiyoda-ku, Tokyo1008251), 三菱ケミカル株式会社 (東京都千代田区丸の内一丁目１番１号) filed a patent application (PCT/JP2025/011775) for "EPOXY RESIN COMPOSITION, INSULATING LAYER, ELECTRIC/ELECTRONIC COMPONENT, PRINTED WIRING BOARD, USE OF EPOXY RESIN COMPOSITION AS RAW MATERIAL FOR INSULATOR, AND METHOD FOR PRODUCING POLYMER" on Mar 25, 2025. With publication no. WO/2025/205795, the details related to the patent application was published on Oct 02, 2025.
Notably, the patent application was submitted under...