GENEVA, July 29 -- LINTEC CORPORATION (23-23, Honcho, Itabashi-ku, Tokyo1730001), リンテック株式会社 (東京都板橋区本町23番23号) filed a patent application (PCT/JP2024/001291) for "METHOD FOR MANUFACTURING THERMOELECTRIC MODULE" on Jan 18, 2024. With publication no. WO/2025/154236, the details related to the patent application was published on Jul 24, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): KIKUCHI, Kazuhiro (c/o LINTEC Corporation, 23-23, Honch...