INTERNATIONAL PATENT: LINTEC CORPORATION, リンテック株式会社 FILES APPLICATION FOR "MARKING DEVICE, MARKING METHOD, SEMICONDUCTOR WAFER AND SEMICONDUCTOR CHIP"

GENEVA, May 12 -- LINTEC CORPORATION (23-23 Honcho, Itabashi-ku, Tokyo1730001), リンテック株式会社 (東京都板橋区本町２３番２３号) filed a patent application (PCT/JP2024/033050) for "MARKING DEVICE, MARKING METHOD, SEMICONDUCTOR WAFER, AND SEMICONDUCTOR CHIP" on Sep 17, 2024. With publication no. WO/2025/094526, the details related to the patent application was published on May 08, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): TAKANO, Ken (c/o LINTEC Corp...