INTERNATIONAL PATENT: LINTEC CORPORATION, リンテック株式会社 FILES APPLICATION FOR "BINDER FOR FIRING AND PASTE COMPOSITION FOR FIRING"

GENEVA, Oct. 5 -- LINTEC CORPORATION (23-23, Honcho, Itabashi-ku, Tokyo1730001), リンテック株式会社 (東京都板橋区本町２３番２３号) filed a patent application (PCT/JP2024/038405) for "BINDER FOR FIRING AND PASTE COMPOSITION FOR FIRING" on Oct 28, 2024. With publication no. WO/2025/203810, the details related to the patent application was published on Oct 02, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): AJINO Keiko (c/o LINTEC CORPORATION, 23-23, Honcho, ...