INTERNATIONAL PATENT: LINTEC CORPORATION, リンテック株式会社 FILES APPLICATION FOR "ADHESIVE FOR HIGH-FREQUENCY DIELECTRIC HEATING AND STRUCTURE"

GENEVA, Sept. 30 -- LINTEC CORPORATION (23-23, Honcho, Itabashi-ku, Tokyo1730001), リンテック株式会社 (東京都板橋区本町２３番２３号) filed a patent application (PCT/JP2025/010010) for "ADHESIVE FOR HIGH-FREQUENCY DIELECTRIC HEATING AND STRUCTURE" on Mar 14, 2025. With publication no. WO/2025/197807, the details related to the patent application was published on Sep 25, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): TSUCHIBUCHI, Koji (c/o LINTEC Corporatio...