GENEVA, May 13 -- LINTEC CORPORATION (23-23, Honcho, Itabashi-ku, Tokyo1730001), リンテック株式会社 (東京都板橋区本町23番23号) filed a patent application (PCT/JP2024/037441) for "ADHESIVE FOR HIGH-FREQUENCY DIELECTRIC HEATING" on Oct 21, 2024. With publication no. WO/2025/094747, the details related to the patent application was published on May 08, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): KAKIUCHI Yasuhiko (c/o LINTEC Corporation, 23-23, Honcho...