INTERNATIONAL PATENT: LEADRIVE TECHNOLOGY (SHANGHAI) CO., LTD., 臻驱科技（上海）股份有限公司 FILES APPLICATION FOR "POWER SEMICONDUCTOR MODULE HAVING DOUBLE-SIDED HEAT DISSIPATION AND POWER SEMICONDUCTOR PACKAGING ASSEMBLY"

Posted On: 2025-08-10

GENEVA, Aug. 10 -- LEADRIVE TECHNOLOGY (SHANGHAI) CO., LTD. (3F, #19 Building 8, 498 Guo Shoujing Road, Shanghai Free Trade ZonePudong New Area, Shanghai 201203), 臻驱科技（上海）股份有限公司 (中国上海市浦东新区自由贸易试验区郭守敬路498号8幢19号楼3层) filed a patent application (PCT/CN2024/136686) for "POWER SEMICONDUCTOR MODULE HAVING DOUBLE-SIDED HEAT DISSIPATION, AND POWER SEMICONDUCTOR PACKAGING ASSEMBLY" on Dec 04, 2024. With publication no. WO/2025/161671, the details related to the patent application was...

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INTERNATIONAL PATENT: LEADRIVE TECHNOLOGY (SHANGHAI) CO., LTD., 臻驱科技（上海）股份有限公司 FILES APPLICATION FOR "POWER SEMICONDUCTOR MODULE HAVING DOUBLE-SIDED HEAT DISSIPATION AND POWER SEMICONDUCTOR PACKAGING ASSEMBLY"