INTERNATIONAL PATENT: KOREA INSTITUTE OF MACHINERY & MATERIALS, 한국기계연구원 FILES APPLICATION FOR "WAFER DEBONDING METHOD"

GENEVA, Feb. 17 -- KOREA INSTITUTE OF MACHINERY & MATERIALS (156, Gajeongbuk-roYuseong-guDaejeon 34103), 한국기계연구원 (대전광역시유성구가정북로 156) filed a patent application (PCT/KR2024/011645) for "WAFER DEBONDING METHOD" on Aug 07, 2024. With publication no. WO/2025/033957, the details related to the patent application was published on Feb 13, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): HAN, Seong Heum (17 Sangdae-roYuseong-guDaejeon 34198), 한성흠 (&#...