INTERNATIONAL PATENT: KOREA ELECTRONICS TECHNOLOGY INSTITUTE, 한국전자기술연구원 FILES APPLICATION FOR "CONDUCTIVE AND INSULATING COMPOSITE HEAT DISSIPATION PAD AND MANUFACTURING METHOD THEREFOR"

GENEVA, July 3 -- KOREA ELECTRONICS TECHNOLOGY INSTITUTE (25 Saenari-ro,Bundang-gu, Seongnam-si,Gyeonggi-do 13509), 한국전자기술연구원 (경기도성남시 분당구새나리로 25) filed a patent application (PCT/KR2024/017764) for "CONDUCTIVE AND INSULATING COMPOSITE HEAT DISSIPATION PAD AND MANUFACTURING METHOD THEREFOR" on Nov 11, 2024. With publication no. WO/2025/135506, the details related to the patent application was published on Jun 26, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WI...