GENEVA, April 19 -- KONICA MINOLTA, INC. (2-7-2, Marunouchi, Chiyoda-ku, Tokyo1007015), コニカミノルタ株式会社 (東京都千代田区丸の内二丁目７番２号) filed a patent application (PCT/JP2024/033188) for "COMPOSITION, THERMOSETTING ADHESIVE, LAMINATE, METHOD FOR MANUFACTURING LAMINATE, FLEXIBLE CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE" on Sep 18, 2024. With publication no. WO/2025/079399, the details related to the patent application was published on Apr 17, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is man...