GENEVA, Nov. 3 -- KOKI COMPANY LIMITED (32-1, Senju Asahi-cho, Adachi-ku, Tokyo1200026), 株式会社弘輝 (東京都足立区千住旭町３２番１) filed a patent application (PCT/JP2025/013735) for "FLUX FOR SOLDERING AND SOLDERING MATERIAL" on Apr 04, 2025. With publication no. WO/2025/225335, the details related to the patent application was published on Oct 30, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): YUKIKATA Kazuhiro (c/o KOKI COMPANY LIMITED, 32-1, Senju Asahi-cho, Adachi-ku...