GENEVA, July 3 -- KANEKA CORPORATION (2-3-18, Nakanoshima, Kita-ku, Osaka-shi, Osaka5308288), 株式会社カネカ (大阪府大阪市北区中之島２－３－１８) filed a patent application (PCT/JP2024/045443) for "RESIN COMPOSITION, MOLDED BODY, AND FILM" on Dec 23, 2024. With publication no. WO/2025/135187, the details related to the patent application was published on Jun 26, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): KATAYAMA, Keisuke (c/o KANEKA CORPORATION...