GENEVA, June 11 -- KANEKA CORPORATION (3-18, Nakanoshima 2-chome, Kita-ku, Osaka-shi, Osaka5308288), 株式会社カネカ (大阪府大阪市北区中之島二丁目3番18号) filed a patent application (PCT/JP2024/041974) for "MOLDED BODY CONTAINING RECYCLED POLYESTER-BASED RESIN" on Nov 27, 2024. With publication no. WO/2025/115902, the details related to the patent application was published on Jun 05, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): NISHI...