INTERNATIONAL PATENT: KABUSHIKI KAISHA TOKAI RIKA DENKI SEISAKUSHO, 株式会社東海理化電機製作所 FILES APPLICATION FOR "METHOD FOR MANUFACTURING SEMICONDUCTOR WAFER AND SEMICONDUCTOR WAFER"

GENEVA, Dec. 1 -- KABUSHIKI KAISHA TOKAI RIKA DENKI SEISAKUSHO (3-260 Toyota, Oguchi-cho, Niwa-gun, Aichi4800195), 株式会社東海理化電機製作所 (愛知県丹羽郡大口町豊田三丁目２６０番地) filed a patent application (PCT/JP2025/015078) for "METHOD FOR MANUFACTURING SEMICONDUCTOR WAFER, AND SEMICONDUCTOR WAFER" on Apr 17, 2025. With publication no. WO/2025/243744, the details related to the patent application was published on Nov 27, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is manag...