GENEVA, Dec. 1 -- KABUSHIKI KAISHA TOKAI RIKA DENKI SEISAKUSHO (3-260 Toyota, Oguchi-cho, Niwa-gun, Aichi4800195), 株式会社東海理化電機製作所 (愛知県丹羽郡大口町豊田三丁目２６０番地) filed a patent application (PCT/JP2025/015077) for "METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP, WAFER LAMINATE, AND SEMICONDUCTOR CHIP" on Apr 17, 2025. With publication no. WO/2025/243743, the details related to the patent application was published on Nov 27, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, ...