GENEVA, Nov. 18 -- JSR CORPORATION (9-2, Higashi-Shinbashi 1-chome, Minato-ku, Tokyo1058640), JSR株式会社 (東京都港区東新橋一丁目9番2号) filed a patent application (PCT/JP2025/016993) for "RESIN COMPOSITION, CURED PRODUCT, PREPREG, COPPER-CLAD LAMINATE, AND INTERLAYER INSULATING FILM" on May 09, 2025. With publication no. WO/2025/234476, the details related to the patent application was published on Nov 13, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): SA...