GENEVA, Feb. 17 -- JICC-02, LTD. (9-2, Higashi-Shinbashi 1-chome, Minato-ku, Tokyo1058640), ＪＩＣＣ－０２株式会社 (東京都港区東新橋一丁目９番２号) filed a patent application (PCT/JP2024/025960) for "METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE AND COMPOSITION FOR FORMING UNDERLAYER FILM FOR METAL-CONTAINING RESIST" on Jul 19, 2024. With publication no. WO/2025/033138, the details related to the patent application was published on Feb 13, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Inte...