INTERNATIONAL PATENT: JCU CORPORATION, 株式会社ＪＣＵ, TOHOKU UNIVERSITY, 国立大学法人東北大学 FILES APPLICATION FOR "SUBSTRATE FOR HYBRID BONDING, HYBRID BONDING STRUCTURE AND METHODS FOR MANUFACTURING SAME"

Posted On: 2025-09-09

GENEVA, Sept. 9 -- JCU CORPORATION (8-1, Higashiueno 4-chome, Taito-ku, Tokyo1100015), 株式会社ＪＣＵ (東京都台東区東上野４丁目８番１号), TOHOKU UNIVERSITY (2-1-1, Katahira, Aoba-ku, Sendai-shi, Miyagi9808577), 国立大学法人東北大学 (宮城県仙台市青葉区片平二丁目１番１号) filed a patent application (PCT/JP2024/041193) for "SUBSTRATE FOR HYBRID BONDING, HYBRID BONDING STRUCTURE, AND METHODS FOR MANUFACTURING SAME" on Nov 20, 2024. With publica...

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INTERNATIONAL PATENT: JCU CORPORATION, 株式会社ＪＣＵ, TOHOKU UNIVERSITY, 国立大学法人東北大学 FILES APPLICATION FOR "SUBSTRATE FOR HYBRID BONDING, HYBRID BONDING STRUCTURE AND METHODS FOR MANUFACTURING SAME"